Alchip Technologies showcased their recent achievements and future direction at the TSMC 2024 North America Technology Symposium in Santa Clara, CA, and Workshop in Austin, TX. The focus of their exhibit was on advanced technology and chiplet design plans. In addition to these events, Alchip will also be participating in TSMC NA Technology Workshops in Boston, MA, and Technology Symposiums in Europe, Taiwan, China, and Japan.
At their booth, Alchip highlighted their expertise in high-performance computing design within the ASIC industry. They discussed their success with complex projects, including full reticle size designs over 800mm² on cutting-edge FinFET technology. Alchip engineers also showcased their advanced package production capabilities, such as CoWoS® designs on advanced nodes, power levels exceeding 1000W, and packages larger than 70x80mm2 that are currently in production.
Alchip emphasized their strong industry partnerships, including their membership with TSMC Open Innovation Platform® (OIP) Value Chain Alliance (VCA) and 3DFabricTM Alliance. They are known for providing silicon design and production services for system companies developing complex and high-volume ASICs and SoCs. They offer faster time-to-market and cost-effective solutions for SoC design across various process technologies.
Founded in 2003 and headquartered in Taipei, Taiwan, Alchip Technologies has established itself as a high-performance ASIC leader through its expertise in 2.5D/3DIC design, CoWoS/chiplet design, and manufacturing management. Their customers include global leaders in AI, HPC/supercomputer, mobile phones