Micron Technology Begins Mass Production of High-Capacity 200+ Layer QLC NAND

Micron Technology Inc., a semiconductor manufacturing company, has announced the mass production of its 232-layer QLC NAND flash memory. The memory is currently being shipped to enterprise storage customers and sampled to original equipment PC manufacturers. This latest technology offers improved performance for a variety of storage use cases, including mobile, client, edge, and data center storage.

According to Micron, the 232-layer QLC NAND is more compact, allowing for thinner and lighter devices, and has a higher bit-density with NAND I/O speeds of 2400 MT/s, a 50% improvement over the previous generation. It also provides better read and programming performance over its predecessor.

The Micron 2500 Client SSD integrates the 232-layer QLC NAND to enhance everyday computing and improve the PC user experience. It has demonstrated superior PCMark 10 benchmark results, outperforming average scores in the value SSD segment. Micron anticipates that the 2500 SSD will accelerate QLC adoption in PCs due to its performance and value proposition.

One of the key features of the Micron 2500 SSD is its ability to offer up to 7.1 GB/s sequential read speeds, surpassing both TLC-based NAND and QLC-based NAND SSDs in the value segment. The accelerated caching feature enables faster read and write performance in various applications. The endurance provided by the 232-layer QLC NAND also ensures that these devices can support multiple 4K movie downloads per day for three years, even in smaller capacity options like the 512GB option.

The Micron 2500 SSD is available in different form factors and capacities ranging from

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